International Conference on Thermal Systems and Mechanical Engineering Innovations - (ICTSMEI-26)


11th - 12th December, 2026 | Seoul, South Korea

Multi-format (In-person/Virtual)

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Important Dates

Pre-registration Deadline

11th November, 2026

Paper Submission Deadline

21st November, 2026

Last Date Of Registration

26th November, 2026

Date Of Conference

11th - 12th December, 2026

Downloads

Conference Flyer
Sample Abstract
Sample Full Paper

Why should attend?

  • Our events provide a great opportunity to interact with distinguished national and international speakers.
  • Attendees can also participate in thought-provoking case discussions.
  • Participants can join special and professional groups.
  • They also get access to profound and the latest research ideas.
  • Researchers can showcase their findings through a poster or oral presentation.
  • Attendees can collaborate with the best industry professionals at events and pave the way for profitable partnerships.
  • Opportunity to network and associate with like-minded professionals.
  • To get inspired to pursue professional studies.
  • To earn a reputation and gain recognition for expertise

Empowering Research Continuity

At Research Leagues, academic engagement continues without interruption despite the current global situation. Researchers can present and publish through online and integrated participation pathways.